Heated Bed, Snapmaker U1

Heated Bed, Snapmaker U1 provides a stable and evenly heated build surface to improve part adhesion during the printing process. It helps reduce warping and prevents first-layer detachment.

Compatible with Snapmaker U1, this heated bed can reach a maximum temperature of 100°C with excellent thermal regulation precision. It is designed to enhance surface adhesion and reduce warping risks. Its structure combines plastic and metal for rigidity and stability, with a weight of 1013 g. It supports a wide range of materials such as PLA, PETG, TPU, and PVA.

• Maximum temperature of 100°C
• Stable and precise thermal regulation
• Improved part adhesion
• Reduced warping and deformation
• Compatible with PLA, PETG, TPU, PVA